TSM-DS3b is a thermally stable, industry leading low loss core (Df = 0.0011 at 10 GHz) can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. TSM-DS3b is a ceramic-filled reinforced material with very low fiberglass content (~ 5%) that rival epoxies in fabricating large format complex multilayers.
TSM-DS3b was developed for high power applications (TC: 0.65 W/m*K) where it is necessary for the dielectric material to conduct heat away from other heat sources in a PWB design. TSM-DS3b was also developed to have very low coefficients of thermal expansion for demanding thermal cycling.
|Part Name||DK + Tolerance||Loss Factor||Comments|
|TSM-DS3b||3.0 +/- 0.04||0.0011||Dimensionally stable low loss laminate, rivals epoxy|