Taconic

RF-35

RF-35 is the best choice for low cost, high volume commercial microwave and radio frequency applications. RF-35 has excellent peel strength for 1/2 ounce and 1 ounce copper (even in comparison to standard epoxy materials), a critical aspect whenever rework is required. RF-35’s ultra low moisture absorption rate and low dissipation factor minimize phase shift with frequency.

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RF-10

RF-10 copper clad laminates are composites of ceramic filled PTFE and woven fiberglass. RF-10 has the advantage of high dielectric constant and low dissipation factor. Thin woven fiberglass reinforcement is used to offer both low dielectric loss and improved rigidity for ease of handling and improved dimensional stability for multilayer circuits.

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TSM-DS3M

TSM-DS3M is a thermally stable, industry leading low loss core (Df = 0.0011 at 10 GHz) that can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. TSM-DS3M is a ceramic-filled reinforced material with very low fiberglass content (~ 5%) that rival epoxies in fabricating large format complex multilayers

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Ceramic Filled PTFE Laminates offer enhanced thermal and electrical stability.

Part Name DK + Tolerance Loss Factor Comments
EZ-IO-F 2.8, 2.77 +/- 0.05 0.0015, 0.0014 Thermally stable composite based on nanotechnology, spread weave and PTFE
EZ-IO 2.8 +/- 0.05 0.0012 Thermally stable composite based on nanotechnology and PTFE
TSM-DS3M 2.94 +/- 0.05 0.0011 Dimensionally stable low loss laminate, rivals epoxy
RF-301 2.97 +/- 0.07 0.0012 High volume antenna material
RF-30A 2.97 +/- 0.07 0.0013 High volume antenna material
TSM-DS3b 3.0 +/- 0.04 0.0011 Dimensionally stable low loss laminate, rivals epoxy
NF-30 3.00 +/- 0.04 0.0013 Ceramic-filled PTFE composites
without a woven fiberglass reinforcement
TSM-DS3 3.0 +/- 0.05 0.0011 Dimensionally stable low loss laminate, rivals epoxy
RF-30 3.0 +/- 0.1 0.0014 High volume antenna material
TLF-35A 3.5 +/- 0.05 0.002 Low cost base material
RF-35HTC 3.5 +/- 0.05 0.0007 High thermal conductivity laminate
RF-35TC-A 3.5 +/- 0.05 0.0017 Thermally conductive low loss laminate
RF-35TC 3.5 +/- 0.05 0.0011 High thermal conductivity base material
RF-35A2 3.5 +/- 0.05 0.0018 Low loss power amplifier material
RF-35 3.5 +/- 0.1 0.0018 High volume microwave & RF laminate
RF-41, RF-43, RF-45 4.1, 4.3, 4.5 +/-0.15 0.0038 0.0033 0.0037 RF laminate with FR4 DK values
TRF-43 4.3 +/- 0.15 0.0035 Low cost RF laminate with FR4 DK values
RF-60TC 6.15 +/- 0.15 0.0022 High DK, high thermal conductivity material
RF-60A 6.15 +/- 0.25 0.0028 Low moisture absorption, stable Dk over frequency
CER-10 10.00 +/- 0.50 0.0035 organic-ceramic laminate based on woven glass reinforcement
RF-10 10.2 +/- 0.30 0.0025 Low Loss, High DK material

Woven Glass Reinforced PTFE Laminates contain fiberglass as a mechanical reinforcement for increased dimensional stability.

Part Name DK + Tolerance Loss Factor Comments
TLY 2.17- 2.20 +/- 0.02 0.0009 Military grade very low DK base material
TLY-5Z 2.20 +/- 0.04 0.0015 Low Dk, low Z axis laminate
TLP 2.2, 2.33+/- 0.03 0.0009 Low cost volume material
TLX 2.45-2.65 +/- 0.04 0.0015-0.0021 Low DK base material
TLT 2.45-2.65 +/- 0.04 - Low DK base material
TLA 2.62 0.0012 Low cost antenna laminate
TLC 2.75 3.0 3.2 0.0022 0.0028 0.0030 Low cost RF laminate
TLE 2.95 0.0026 Thin dielectric base material for couplers

Bond Plies / Prepregs are thermoplastic and thermoset bonding layers used in multilayer PWB constructions that may be non-reinforced or contain very low fiberglass content.

Part Name DK + Tolerance Loss Factor Comments
FEP 2.0 0.0003 Thermoplastic bonding film
TacBond 1.5 2.35 0.0025 Thermoplastic bonding film
fastRise™ 25,26, 27, 28(FR-27-0045-35) 2.72 +/- 0.04 0.0014 Lowest loss non-reinforced prepreg
fastRise™EZ pure 2.8 0.0032 Low temperature curing, thermosetting prepreg
fastRise™7 7.45 0.0030 High DK, low loss glass reinforced prepreg

Specialty Materials are Taconic's unique PTFE compositions that vary in formulation, cladding and available sizes from our standard materials.

Part Name DK + Tolerance Loss Factor Comments
TacSil - - FPC Carrier Tape
Long Laminates 2.17- 3.5 - Oversized base materials for antenna PCBs
Heavy Metal Backed Base Materials 2.1-10 - For power amplifier and radio link PCBs
TLM (unclad) - - Unclad materials for gaskets, etc.
TLC Specialty Products 3.8, 3.5 0.0034 0.0037 Low cost specialty RF laminate